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\nThese defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout.\n
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These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout.
\n schovat popis- Nakladatel: Springer Verlag, Singapore
- Kód:
- Rok vydání: 2023
- Jazyk: Angličtina
- Vazba: Taschenbuch
- Počet stran: 140
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