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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe...
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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
schovat popis
- Nakladatel: A S M International
- Kód:
- Rok vydání: 2022
- Jazyk: Angličtina
- Vazba: Brožovaná
- Počet stran: 461
- Šířka balení: 28.6 cm
- Výška balení: 23.1 cm
- Hloubka balení: 3.1 cm
- Váha balení: 1.2 kg
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